Samsung Electro-Mechanics and Nvidia partner on ABF substrates for AI chips

The two companies plan to jointly invest in dedicated substrate lines in South Korea as AI packaging becomes a supply bottleneck Samsung Electro-Mechanics and Nvidia have announced a strategic partnership to expand production and supply of ABF package substrates. These components sit underneath the high-performance processors and networking switches that power AI infrastructure. The deal was announced on October 21, 2026. It targets one of the least glamorous and most stubborn constraints in the AI buildout: the materials that hold advanced chips together. Under the arrangement, Samsung Electro-Mechanics (SEMCO) and Nvidia intend to jointly invest in dedicated manufacturing lines. Those lines will be located at SEMCO’s facilities in Sejong and Busan, South Korea. Production is scheduled to start in 2026, with supply to Nvidia expected to begin that year.

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