Nvidia and SPIL plan 15x expansion of co-packaged optics capacity by mid-2027

Nvidia plans to scale co-packaged optics capacity dramatically as AI infrastructure demands push past the limits of copper interconnects Jensen Huang has a habit of making big predictions, and his latest one involves the pipes, not the chips. At Nvidia ’s GTC Berlin event, the CEO said that optical networking in AI data centers could drive demand for optical components up by 15 times, a figure that reflects just how severely current interconnect technology is straining under the weight of modern AI workloads. The number is striking, but the logic behind it is straightforward. As AI models grow larger and data centers pack in more and more accelerators, the cables and connectors linking those chips together become a genuine bottleneck.

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