TSMC to build base dies for Nvidia’s custom HBM chips

Nvidia is reportedly steering Samsung, SK Hynix, and Micron toward TSMC's 3nm process for its new NVHBM memory standard Nvidia wants its AI memory built a very specific way. It also wants one company doing the most important part of the building. Taiwan Semiconductor Manufacturing Company will reportedly supply its 3nm process technology for the base dies of Nvidia’s custom high-bandwidth memory stacks, a product line Nvidia calls NVHBM. The arrangement, reported on October 18, 2026, draws all three major memory makers into TSMC’s orbit: Samsung Electronics, SK Hynix, and Micron. The most eye-catching detail involves Samsung. This is reportedly the first time Samsung has worked with TSMC on HBM base die manufacturing specifically. Nvidia announced NVHBM in August 2026.

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