Micron outlines memory and storage roadmap through 2030

The chipmaker plans a new HBM generation every year, vertical HBM, GPU-accessible flash and denser DRAM and NAND aimed at AI workloads Micron Technology has laid out where its memory business is headed for the rest of the decade, and the answer is mostly AI. The company’s roadmap runs through 2030 and includes vertical high-bandwidth memory and flash storage that GPUs can access directly. The roadmap came out of a Micron technology webinar on October 21, 2026, led by President Scott DeBoer. The headline commitment: a new generation of high-bandwidth memory (HBM) every year through 2030. Micron’s sequence starts with HBM4 in 2026 and runs to HBM6 in 2030. Custom HBM and vertical HBM options are slated to begin in 2028.

BeCrypto News shows a short excerpt and links to the publisher. The full report belongs to Crypto Briefing.