Malaysia unveils six homegrown chips in push beyond assembly lines

The country showcased designs for AI, automotive, satellite and drone uses as it tries to move up the semiconductor value chain Malaysia has spent roughly half a century putting other people’s chips together. Now it wants its name on the blueprint. On October 16, 2026, the country showcased six semiconductor chips at the Selangor AI & Semiconductor Summit. All six were developed by companies based in the Malaysia Semiconductor IC Design Park. They are part of a deliberate effort to shift from assembly and packaging toward chip design and intellectual property ownership. The combined estimated sales potential is RM300 million (approximately $74 million) a year. The six chips target a spread of applications: artificial intelligence, automotive technology, satellite systems and drone operations. SkyeChip’s MARS1000 is built for edge-AI applications.

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