Cisco Expands AI Networking Lineup With G302 Chip and USFP Optics

Cisco is expanding its AI networking portfolio with higher-capacity switching silicon, a planned optical form factor and security tools designed to keep open networks operating during maintenance. The announcements came at the Open Compute Project Global Summit in San Jose, where Cisco presented networking as a core part of AI infrastructure. Cisco showcased its 102.4-Tbps Silicon One G300 and introduced the 51.2-Tbps G302, which uses 200G SerDes and is designed for top-of-rack systems. G300-powered systems are shipping to customers, while G302-powered systems are planned to begin shipping before the end of 2026.

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